JOURNAL OF ELECTRONIC MATERIALS, vol. 32, no. 11, page. 1148 - 1154, 2003-11
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ACTA MATERIALIA, vol. 55, no. 20, page. 6705 - 6712, 2007-12
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IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, vol. 17, no. 1, page. 1 - 6, 2007-03
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PROCEEDINGS OF THE COMBUSTION INSTITUTE, vol. 30, page. 735 - 742, 2005-01
JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 50, no. 2, 2011-02
IEICE TRANSACTIONS ON COMMUNICATIONS, vol. E89-B, no. 7, page. 2050 - 2060, 2006-07
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IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, vol. 11, no. 3, page. 990 - 999, 2012-03
JOURNAL OF BIOLOGICAL CHEMISTRY, vol. 278, no. 34, page. 31731 - 31736, 2003-08-22
JOURNAL OF MATERIALS RESEARCH, vol. 24, no. 5, page. 1716 - 1721, 2009-05
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METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE, vol. 35, no. 1, page. 115 - 120, 2004-02
NUCLEAR FUSION, vol. 40, no. 3Y, page. 575 - 582, 2000-03
IEEE COMMUNICATIONS LETTERS, vol. 11, no. 1, page. 28 - 30, 2007-01
IEEE COMMUNICATIONS LETTERS, vol. 15, no. 9, page. 919 - 921, 2011-09