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Article
Effect of curing temperature on the adhesion strength of polyamideimide/copper jointsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 12, no. 5, page. 507 - 521, 1998-01

Article
Effects of coupling agent thickness on residual stress in polyimide/gamma-APS/silicon wafer jointsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 13, no. 7, page. 805 - 818, 1999-01

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