Transfer or delivery of micro light-emitting diodes for light-emitting diode displays

Abstract

As the next-generation display technology, microscale light-emitting diode (mu-LED) displays have attracted significant attention recently. For applying mu-LEDs as direct emissive pixels in everyday display applications, many chips in a relatively small-sized wafer must be relocated and distributed quickly over a wide screen area via so-called transfer technology. After a brief review of current conventional transfer technologies for placing mu-LEDs on a wide screen, for perspective, a new and versatile delivery technique for mu-LEDs is presented, in which an LED chip is converted to a ball shape in order to facilitate handling and processing of mu-LEDs for practical applications. Plausible procedures including the formation, arrangement, and removal of the plastic ball are discussed to envision potential impacts of the technology. (c) 2019 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).