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Cited 38 time in webofscience Cited 41 time in scopus
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dc.contributor.authorMisha, SH-
dc.contributor.authorTamanna, N-
dc.contributor.authorWoo, J-
dc.contributor.authorLee, S-
dc.contributor.authorSong, J-
dc.contributor.authorPark, J-
dc.contributor.authorLim, S-
dc.contributor.authorPark, J-
dc.contributor.authorHwang, H-
dc.date.accessioned2015-06-25T01:49:26Z-
dc.date.available2015-06-25T01:49:26Z-
dc.date.created2015-03-04-
dc.date.issued2015-01-
dc.identifier.issn2162-8742-
dc.identifier.other2015-OAK-0000032461en_US
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/10092-
dc.description.abstractThe switching uniformity and reliability of the TaOx based resistive random access memory (RRAM) device were investigated with varying nitrogen doping concentration. The nitrogen doped samples shows excellent electrical and reliability characteristics such as small switching variability for 3-bit multilevel per cell (MLC), low power operation and good retention properties. Compared with control sample, improved device characteristics of nitrogen doped device can be explained by nitrogen induced filament confinement. (C) The Author(s) 2015. Published by ECS.-
dc.description.statementofresponsibilityopenen_US
dc.languageEnglish-
dc.publisherThe Electrochemical Society-
dc.relation.isPartOfECS Solid State Letters-
dc.rightsBY_NC_NDen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/2.0/kren_US
dc.titleEffect of nitrogen doping on variability of TaOx-RRAM for low-power 3-bit MLC applications-
dc.typeArticle-
dc.contributor.college신소재공학과en_US
dc.identifier.doi10.1149/2.0011504ssl-
dc.author.googleMisha, SHen_US
dc.author.googleTamanna, Nen_US
dc.author.googleHwang, Hen_US
dc.author.googleLim, Sen_US
dc.author.googlePark, Jen_US
dc.author.googleSong, Jen_US
dc.author.googleLee, Sen_US
dc.author.googleWoo, Jen_US
dc.relation.volume4en_US
dc.relation.issue3en_US
dc.relation.startpage25en_US
dc.relation.lastpage28en_US
dc.contributor.id10079928en_US
dc.relation.journalECS Solid State Lettersen_US
dc.relation.indexSCI급, SCOPUS 등재논문en_US
dc.relation.sciSCIen_US
dc.collections.nameJournal Papersen_US
dc.type.rimsART-
dc.identifier.bibliographicCitationECS Solid State Letters, v.4, no.3, pp.25 - 28-
dc.identifier.wosid000348423000006-
dc.date.tcdate2019-01-01-
dc.citation.endPage28-
dc.citation.number3-
dc.citation.startPage25-
dc.citation.titleECS Solid State Letters-
dc.citation.volume4-
dc.contributor.affiliatedAuthorHwang, H-
dc.identifier.scopusid2-s2.0-84923370616-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc7-
dc.type.docTypeArticle-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-

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황현상HWANG, HYUNSANG
Dept of Materials Science & Enginrg
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