Terahertz Packaging for Practical Applications

Abstract

In the last couple of decades, semiconductor device technologies, particularly electronic devices, have been greatly advanced and investigated for possible use in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and ICs and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication.To deal with those issues, THz packaging technologies have been investigated. In this talk, recent progress in interconnections and packaging technologies will mainly be overviewed, particularly in the frequency range of 0.1 - 3 THz, where state-of-the-art electronic devices can operate. © 2019 EuMCE.