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dc.contributor.authorKIM, JS-
dc.contributor.authorLEE, JL-
dc.contributor.authorMA, DS-
dc.contributor.authorPARK, HM-
dc.contributor.authorSHIM, KH-
dc.contributor.authorTANIGAWA, S-
dc.contributor.authorUEDONO, A-
dc.date.accessioned2015-06-25T02:07:56Z-
dc.date.available2015-06-25T02:07:56Z-
dc.date.created2009-02-28-
dc.date.issued1989-01-01-
dc.identifier.issn0021-8979-
dc.identifier.other2015-OAK-0000008411en_US
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/10437-
dc.description.statementofresponsibilityopenen_US
dc.languageEnglish-
dc.publisherAMER INST PHYSICS-
dc.relation.isPartOfJOURNAL OF APPLIED PHYSICS-
dc.rightsBY_NC_NDen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/2.0/kren_US
dc.titleDEPTH PROFILES OF VACANCY-TYPE DEFECT IN SI+-IMPLANTED GAAS RESULTING FROM RAPID THERMAL ANNEALING-
dc.typeArticle-
dc.contributor.college신소재공학과en_US
dc.identifier.doi10.1063/1.342559-
dc.author.googleKIM, JSen_US
dc.author.googleLEE, JLen_US
dc.author.googleUEDONO, Aen_US
dc.author.googleTANIGAWA, Sen_US
dc.author.googleSHIM, KHen_US
dc.author.googlePARK, HMen_US
dc.author.googleMA, DSen_US
dc.relation.volume65en_US
dc.relation.startpage396en_US
dc.relation.lastpage397en_US
dc.contributor.id10105416en_US
dc.relation.journalJOURNAL OF APPLIED PHYSICSen_US
dc.relation.indexSCI급, SCOPUS 등재논문en_US
dc.relation.sciSCIen_US
dc.collections.nameJournal Papersen_US
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF APPLIED PHYSICS, v.65, no.1, pp.396 - 397-
dc.identifier.wosidA1989R470600067-
dc.citation.endPage397-
dc.citation.number1-
dc.citation.startPage396-
dc.citation.titleJOURNAL OF APPLIED PHYSICS-
dc.citation.volume65-
dc.contributor.affiliatedAuthorLEE, JL-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc4-
dc.type.docTypeNote-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-

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이종람LEE, JONG LAM
Dept of Materials Science & Enginrg
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