Conference
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | KIM, DONG SUNG | - |
| dc.contributor.author | LEE, SEONG JIN | - |
| dc.contributor.author | PARK, SANGMIN | - |
| dc.contributor.author | HAN, SEON JIN | - |
| dc.date.accessioned | 2020-12-14T14:53:42Z | - |
| dc.date.available | 2020-12-14T14:53:42Z | - |
| dc.date.created | 2020-12-10 | - |
| dc.date.issued | 2020-09-14 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/104581 | - |
| dc.publisher | 정밀공학회 | - |
| dc.relation.isPartOf | 2020 한국 정밀공학회 통합학술대회 | - |
| dc.relation.isPartOf | 2020 한국 정밀공학회 통합학술대회 | - |
| dc.title | 3차원 비전도성 곡면 표면 상 나노파티클 코팅을 위한 전해질 용액 기반 전기 분무 증착 공정 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | 2020 한국 정밀공학회 통합학술대회 | - |
| dc.citation.conferenceDate | 2020-09-14 | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 2020 한국 정밀공학회 통합학술대회 | - |
| dc.contributor.affiliatedAuthor | KIM, DONG SUNG | - |
| dc.contributor.affiliatedAuthor | LEE, SEONG JIN | - |
| dc.contributor.affiliatedAuthor | PARK, SANGMIN | - |
| dc.contributor.affiliatedAuthor | HAN, SEON JIN | - |
| dc.description.journalClass | 2 | - |
| dc.description.journalClass | 2 | - |
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Related Researcher
- 김동성KIM, DONG SUNG
- Dept of Mechanical Enginrg