Open Access System for Information Sharing

Login Library

 

Article
Cited 1 time in webofscience Cited 1 time in scopus
Metadata Downloads

Microstructural and electrical investigation of Pd/Ge/Ti/Au ohmic contact to pseudomorphic high electron mobility transistor with undoped cap layer SCIE SCOPUS

Title
Microstructural and electrical investigation of Pd/Ge/Ti/Au ohmic contact to pseudomorphic high electron mobility transistor with undoped cap layer
Authors
Kim, YTLee, JLLee, BT
Date Issued
1998-07-15
Publisher
AMER INST PHYSICS
Abstract
Microstructural reactions of Pd/Ge/Ti/Au contact to AlGaAs/InGaAs pseudomorphic high electron mobility transistor with an undoped GaAs/AlGaAs cap layer have been investigated using cross-sectional transmission electron microscopy, and the results are used to interpret the electrical properties of the ohmic contact. In the as-deposited state, a quaternary phase of PdxAlGaAs containing excess Ge atoms is formed at the interface of Pd/AlGaAs and some microvoids exist at the Pd layer in the vicinity of the interface. When the ohmic metals deposited on the undoped cap layer were annealed, the lowest contact resistivity of 9.1 x 10(-5) Ohm cm(2) is obtained at 380 degrees C. AuGa compound is formed at the PdGe/undoped-AlGaAs interface as a result of the reaction between the ohmic metal and the undoped GaAs cap. This is due to the fast in-diffusion of Au toward the undoped AlGaAs through grain boundaries of the PdGe compound. The layer structure is changed to TiO/AuGa/PdGe/AuGa(TiAs + epi-Ge)/undoped-AlGaAs. The AuGa compound enhances the creation of group III vacancies, and the in-diffused Ge atoms occupy the vacancies. Thus, a number of electrons are produced below the contact, which plays a role in reducing the contact resistivity. For the ohmic metals deposited on n-AlGaAs by removing the undoped cap layer, the annealing temperature at which the contact resistivity has the minimum value of 2.3 x 10(-6) Ohm cm2 increases to 460 degrees C. The Au2Al is additionally observed at the PdGe/n-AlGaAs interface. Consequently, the layer structure is changed to TiO/AuGa/PdGe/AuGa + Au2Al(TiAs + epi-Ge)/n- type AlGaAs. The formation of Au2Al at the PdGe/n-AlGaAs interface creates more group III vacancies. Thus, the contact resistivity is further reduced by the incorporation of the in-diffused Ge into the group III vacancies. The InGaAs channel layer is observed to be intermixed in the annealed sample. This evidences the production of a large number of the group III vacancies via electrons below the contact. (C) 1998 American Institute of Physics. [S0021-8979(98)04914-7].
URI
https://oasis.postech.ac.kr/handle/2014.oak/10476
DOI
10.1063/1.368155
ISSN
0021-8979
Article Type
Article
Citation
JOURNAL OF APPLIED PHYSICS, vol. 84, no. 2, page. 911 - 917, 1998-07-15
Files in This Item:

qr_code

  • mendeley

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher

이종람LEE, JONG LAM
Dept of Materials Science & Enginrg
Read more

Views & Downloads

Browse