Open Access System for Information Sharing

Login Library

 

Conference
Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Analysis of the Thermal Conductivity in Silicon Scallop Nanowires

Title
Analysis of the Thermal Conductivity in Silicon Scallop Nanowires
Authors
Seungho LeeHyeongsuk YooHyeonsu ChoSol YoonMyunghae SeoByoung Don KongM. MeyyappanBAEK, CHANG KI
Date Issued
2020-07-30
Publisher
전기전자공학자협회(IEEE)
Abstract
Silicon nanowires are attracting attention as strong candidates to replace conventional thermoelectric materials as they overcome the high thermal conductivity of bulk silicon and greatly improve thermoelectric conversion efficiency. In order to improve the thermoelectric efficiency, it is necessary to reduce the thermal conductivity, and the formation of the rough surface on the nanowire is a very effective method for lowering the thermal conductivity. In this paper, a scallop surface was formed on the vertical silicon nanowires by the BOSCH process and reported about 40% reduction in thermal conductivity compared to the Casimir limit. The reason for the decrease in thermal conductivity is due to the phonon backscattering, and the radiation analogy suggests the possibility of the backscattering that is difficult to explain with the phonon boundary scattering.
URI
https://oasis.postech.ac.kr/handle/2014.oak/106080
Article Type
Conference
Citation
The 20th IEEE International Conference on Nanotechnology (IEEE-NANO 2020), 2020-07-30
Files in This Item:
There are no files associated with this item.

qr_code

  • mendeley

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Views & Downloads

Browse