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Cited 20 time in webofscience Cited 25 time in scopus
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dc.contributor.authorLee, T-
dc.contributor.authorJang, D-
dc.contributor.authorAhn, D-
dc.contributor.authorKim, D-
dc.date.accessioned2015-06-25T02:16:00Z-
dc.date.available2015-06-25T02:16:00Z-
dc.date.created2010-05-06-
dc.date.issued2010-02-
dc.identifier.issn0021-8979-
dc.identifier.other2015-OAK-0000021183en_US
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/10633-
dc.description.abstractIn laser-induced backside wet etching (LIBWE), the liquid absorbent indirectly heats the transparent material, causing explosive phase change and cavitation. Accordingly, the hydrodynamics of the absorbing liquid, including the size of the liquid chamber, is strongly related to the ablation process. Because the hydrodynamics is dependent on the elastic deformation of the sample, the sample thickness also affects the performance of LIBWE. In this work, experimental analyses were performed to elucidate the hydrodynamics in LIBWE and the effect on the etch rate by varying the liquid chamber size and sample thickness. A KrF excimer laser was used to ablate fused silica samples in toluene and the etch rate was quantified using a scanning profilometer. Laser flash shadowgraphy and photodeflection probing techniques were employed for in situ measurement of the laser-induced hydrodynamics and displacement of the sample, respectively, with a time resolution of approximately nanoseconds. To directly observe the effect of increased liquid pressure on LIBWE, the liquid pressure on the etching spot was locally increased by an external shock wave and the etch results are examined. This study confirms that the photomechanical effects from the laser-induced bubble plays a key role in the LIBWE process, revealing a linear relationship between the etch rate the applied recoil momentum. However, the dependence of the etch rate on the chamber size and sample thickness could not be explained by the change in recoil momentum, i.e., by the bubble pressure. Instead, transient deformation of the sample by the pressure impact was estimated to be mainly responsible for the dependence.-
dc.description.statementofresponsibilityopenen_US
dc.languageEnglish-
dc.publisherAIP-
dc.relation.isPartOfJOURNAL OF APPLIED PHYSICS-
dc.rightsBY_NC_NDen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/2.0/kren_US
dc.titleEffect of Liquid Environment on Laser-Induced Backside Wet Etching of Fused Silica,”-
dc.typeArticle-
dc.contributor.college기계공학과en_US
dc.identifier.doi10.1063/1.3294615-
dc.author.googleLee, Ten_US
dc.author.googleJang, Den_US
dc.author.googleKim, Den_US
dc.author.googleAhn, Den_US
dc.relation.volume107en_US
dc.relation.issue3en_US
dc.relation.startpage033112.1en_US
dc.relation.lastpage014913.8en_US
dc.contributor.id10103614en_US
dc.relation.journalJOURNAL OF APPLIED PHYSICSen_US
dc.relation.indexSCI급, SCOPUS 등재논문en_US
dc.relation.sciSCIen_US
dc.collections.nameJournal Papersen_US
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF APPLIED PHYSICS, v.107, no.3, pp.33112.1 - 14913.8-
dc.identifier.wosid000274517300012-
dc.date.tcdate2019-01-01-
dc.citation.endPage14913.8-
dc.citation.number3-
dc.citation.startPage33112.1-
dc.citation.titleJOURNAL OF APPLIED PHYSICS-
dc.citation.volume107-
dc.contributor.affiliatedAuthorKim, D-
dc.identifier.scopusid2-s2.0-76949105104-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc14-
dc.type.docTypeArticle-
dc.subject.keywordPlusEXCIMER-LASER-
dc.subject.keywordPlusORGANIC SOLUTION-
dc.subject.keywordPlusLIBWE METHOD-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusABLATION-
dc.subject.keywordPlusGLASS-
dc.subject.keywordPlusQUARTZ-
dc.subject.keywordPlusTOLUENE-
dc.subject.keywordPlusNM-
dc.subject.keywordPlusBREAKDOWN-
dc.subject.keywordAuthorbubbles-
dc.subject.keywordAuthorcavitation-
dc.subject.keywordAuthordeformation-
dc.subject.keywordAuthorlaser ablation-
dc.subject.keywordAuthorlaser beam etching-
dc.subject.keywordAuthorsilicon compounds-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-

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김동식KIM, DONG SIK
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