DC Field | Value | Language |
---|---|---|
dc.contributor.author | CHUNG, YOONYOUNG | - |
dc.contributor.author | Park, Seongmin | - |
dc.contributor.author | PARK, HYUK | - |
dc.date.accessioned | 2021-12-28T08:40:06Z | - |
dc.date.available | 2021-12-28T08:40:06Z | - |
dc.date.created | 2021-12-28 | - |
dc.date.issued | 2018-05 | - |
dc.identifier.issn | 0097-966X | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/108503 | - |
dc.description.abstract | We propose a novel substrate structure to achieve excellent mechanical flexibility. Electronic components on a flexible substrate are affected by surface strain when bent. Our flexible substrate contains a strain-absorbing layer that can effectively reduce the surface strain; thus, flexible devices can be more flexible with minimal electrical degradation. | - |
dc.language | English | - |
dc.publisher | Wiley | - |
dc.relation.isPartOf | Digest of Technical Papers - SID International Symposium | - |
dc.title | Invited Paper: Flexible Substrate Engineering to Enhance Bending Stability | - |
dc.type | Article | - |
dc.identifier.doi | 10.1002/sdtp.12245 | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | Digest of Technical Papers - SID International Symposium, v.49, no.1, pp.892 - 894 | - |
dc.citation.endPage | 894 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 892 | - |
dc.citation.title | Digest of Technical Papers - SID International Symposium | - |
dc.citation.volume | 49 | - |
dc.contributor.affiliatedAuthor | CHUNG, YOONYOUNG | - |
dc.contributor.affiliatedAuthor | Park, Seongmin | - |
dc.contributor.affiliatedAuthor | PARK, HYUK | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.type.docType | Article | - |
dc.description.journalRegisteredClass | other | - |
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