Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps

Abstract

This paper reports the deterministic assembly of microscale silicon objects which are thick (>10 μm) and of arbitrary shape using the elastomeric microtipped stamps. The deterministic assembly consists of the preparation and manipulation of microscale silicon objects. This micromanufacturing strategy, influenced by the microtipped stamp based transfer printing, enables the construction of complex three-dimensional silicon structures which would be difficult or impossible to create using other methods. © 2012 IEEE.