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Cited 53 time in webofscience Cited 54 time in scopus
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dc.contributor.authorYun, JY-
dc.contributor.authorPark, MY-
dc.contributor.authorRhee, SW-
dc.date.accessioned2015-06-25T02:30:18Z-
dc.date.available2015-06-25T02:30:18Z-
dc.date.created2009-03-16-
dc.date.issued1999-05-
dc.identifier.issn0013-4651-
dc.identifier.other2015-OAK-0000010150en_US
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/11089-
dc.description.abstractTetrakis(dimethylamido)titanium (TDMAT) and tetrakis(diethylamido)titanium (TDEAT) as precursors for metallorganic chemical vapor deposition of TiN were compared. H-1 nuclear magnetic resonance (NMR) and differential scanning calorimetry (DSC) were used to study the thermal decomposition behavior of the liquid-phase compounds. NMR spectra showed that TDEAT was thermally stable up to 220 degrees C, while TDMAT began to decompose over 140 degrees C. DSC results also confirmed that TDEAT had a better thermal stability than TDMAT. The gas-phase reaction mechanism of the compounds monitored by in situ Fourier transform infrared spectroscopy and TDEAT was decomposed at higher temperature due to its steric hindrance effect. TDMAT and TDEAT had a similar dissociation mechanism in the liquid and gas phase. Both precursors were decomposed at high temperatures into Ti metal and dialkylamine. The deposition rate of TiN was higher with TDMAT than with TDEAT, and TiN films deposited with TDMAT showed lower carbon content and smooth surface morphology. (C) 1999 The Electrochemical Society. S0013-4651(98)07-050-5. All rights reserved.-
dc.description.statementofresponsibilityopenen_US
dc.languageEnglish-
dc.publisherELECTROCHEMICAL SOC INC-
dc.relation.isPartOfJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.rightsBY_NC_NDen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/2.0/kren_US
dc.titleComparison of tetrakis(dimethylamido)titanium and tetrakis(diethylamido)titanium as precursors for metallorganic chemical vapor deposition of titanium nitride-
dc.typeArticle-
dc.contributor.college화학공학과en_US
dc.identifier.doi10.1149/1.1391847-
dc.author.googleYun, JYen_US
dc.author.googlePark, MYen_US
dc.author.googleRhee, SWen_US
dc.relation.volume146en_US
dc.relation.issue5en_US
dc.relation.startpage1804en_US
dc.relation.lastpage1808en_US
dc.contributor.id10052631en_US
dc.relation.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.relation.indexSCI급, SCOPUS 등재논문en_US
dc.collections.nameJournal Papersen_US
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.146, no.5, pp.1804 - 1808-
dc.identifier.wosid000080343300033-
dc.date.tcdate2019-01-01-
dc.citation.endPage1808-
dc.citation.number5-
dc.citation.startPage1804-
dc.citation.titleJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.citation.volume146-
dc.contributor.affiliatedAuthorRhee, SW-
dc.identifier.scopusid2-s2.0-0032681877-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc39-
dc.type.docTypeArticle-
dc.subject.keywordPlusBARRIER METALLIZATION-
dc.subject.keywordPlusTIN-
dc.subject.keywordPlusSUBMICRON-
dc.subject.keywordPlusALUMINUM-
dc.subject.keywordPlusTICN-
dc.relation.journalWebOfScienceCategoryElectrochemistry-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaElectrochemistry-
dc.relation.journalResearchAreaMaterials Science-

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