Fan-Out Wafer-Level Package mm-Wave/Sub-THz LWA with Wide-Angle Scanning Capability

Abstract

This paper proposes a fan-out wafer-level package (FOWLP) millimeter-wave (mm-Wave)/sub-terahertz (sub-THz) leaky wave antenna (LWA) featuring horizontal plane wide-angle scanning capability. Despite extremely thin antenna substrate due to warpage issues during the FOWLP process, the asymmetrically coplanar transmission line (ACTL) based LWA incorporating unit cell loaded with left-handed LC circuits can exhibit horizontal wide-angle scanning across broad bandwidth. The proposed LWA with 10-cells can be scanned from -30° to 55° between 70 GHz and 140 GHz. Despite realistic measurement setup constraints consisting of only one activation port absence of 50-Omega termination load in the mm-Wave/Sub-THz spectrum, the presented LWA is ascertained to function as an effective traveling-wave antenna.