Fan-Out Wafer-Level Package mm-Wave/Sub-THz LWA with Wide-Angle Scanning Capability
- Title
- Fan-Out Wafer-Level Package mm-Wave/Sub-THz LWA with Wide-Angle Scanning Capability
- Authors
- Lee, Jae-Yeong; Oh, Yerim; Chang, Suho; Cho, Sungmin; Song, Ho-Jin; HONG, WONBIN
- Date Issued
- 2021-12-04
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Abstract
- This paper proposes a fan-out wafer-level package (FOWLP) millimeter-wave (mm-Wave)/sub-terahertz (sub-THz) leaky wave antenna (LWA) featuring horizontal plane wide-angle scanning capability. Despite extremely thin antenna substrate due to warpage issues during the FOWLP process, the asymmetrically coplanar transmission line (ACTL) based LWA incorporating unit cell loaded with left-handed LC circuits can exhibit horizontal wide-angle scanning across broad bandwidth. The proposed LWA with 10-cells can be scanned from -30° to 55° between 70 GHz and 140 GHz. Despite realistic measurement setup constraints consisting of only one activation port absence of 50-Omega termination load in the mm-Wave/Sub-THz spectrum, the presented LWA is ascertained to function as an effective traveling-wave antenna.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/112512
- ISSN
- 0000-0000
- Article Type
- Conference
- Citation
- 2021 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, APS/URSI 2021, page. 117 - 118, 2021-12-04
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- There are no files associated with this item.
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