Prediction of Interfacial Reaction Between Cu and In During Low-Temperature Soldering

Abstract

© 2022, ASM International.Interfacial reaction between Cu and In has been predicted and analyzed based on computational thermodynamics and diffusion kinetics. The Cu11In9 compound phase is predicted to form first and grow dominantly at the initial stage of the reaction between Cu-rich FCC and In-rich liquid phases during low-temperature soldering. The diffusion coefficient in the Cu11In9 compound is assessed to enable a quantitative prediction of the layer growth during the soldering process. The present work enables a reasonable prediction of the interfacial reaction between Cu and In for a given temperature profile, as well as process optimization through control of intermetallic compound growth kinetics.