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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | KIM, JOON WON | - |
| dc.contributor.author | YOO, DONGWOO | - |
| dc.contributor.author | KIM, SANGMOK | - |
| dc.contributor.author | JEONGHYEON, HWANG | - |
| dc.date.accessioned | 2023-02-17T01:42:48Z | - |
| dc.date.available | 2023-02-17T01:42:48Z | - |
| dc.date.created | 2023-02-16 | - |
| dc.date.issued | 2023-01-16 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/115124 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.relation.isPartOf | The 36th IEEE International Conference on MEMS 2023 | - |
| dc.title | A transfer method for embedding conductive fillers on the surface of multi-scale structures for 3D flexible conductors | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | The 36th IEEE International Conference on MEMS 2023 | - |
| dc.citation.conferenceDate | 2023-01-15 | - |
| dc.citation.conferencePlace | GE | - |
| dc.citation.title | The 36th IEEE International Conference on MEMS 2023 | - |
| dc.contributor.affiliatedAuthor | KIM, JOON WON | - |
| dc.contributor.affiliatedAuthor | YOO, DONGWOO | - |
| dc.contributor.affiliatedAuthor | KIM, SANGMOK | - |
| dc.contributor.affiliatedAuthor | JEONGHYEON, HWANG | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalClass | 1 | - |
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- 김준원KIM, JOON WON
- Dept of Mechanical Enginrg