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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | HONG, WONBIN | - |
| dc.contributor.author | Youn, Youngno | - |
| dc.contributor.author | Ahmed Abdelmottaleb Omar | - |
| dc.contributor.author | Kim,Daehyeon | - |
| dc.contributor.author | Chang,Suho | - |
| dc.date.accessioned | 2023-06-07T09:00:55Z | - |
| dc.date.available | 2023-06-07T09:00:55Z | - |
| dc.date.created | 2023-06-05 | - |
| dc.date.issued | 2023-04 | - |
| dc.identifier.issn | 2156-3950 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/117773 | - |
| dc.description.abstract | A low-profile and wideband Sub-THz absorber utilizing a thin resistive ruthenium oxide (RuO2) printing technique is proposed in this article. The proposed absorber exhibits an absorption bandwidth from 108.2 GHz to 171.1 GHz, which represents 45.04 % with a profile of 0.076 λmax which is the free-space wavelength at the lowest frequency. The detailed manufacturing steps are presented along with step-by-step photos of the fabricated sample. The fabricated prototype is validated by the free space measurement setup with good coherence to the simulated results. This invention is expected to provide a practical and concise solution for mitigating electromagnetic interference in future 6G devices. IEEE | - |
| dc.language | English | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.relation.isPartOf | IEEE Transactions on Components, Packaging and Manufacturing Technology | - |
| dc.title | Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing | - |
| dc.type | Article | - |
| dc.identifier.doi | 10.1109/TCPMT.2023.3271962 | - |
| dc.type.rims | ART | - |
| dc.identifier.bibliographicCitation | IEEE Transactions on Components, Packaging and Manufacturing Technology, v.13, no.4, pp.580 - 582 | - |
| dc.identifier.wosid | 001000261100015 | - |
| dc.citation.endPage | 582 | - |
| dc.citation.number | 4 | - |
| dc.citation.startPage | 580 | - |
| dc.citation.title | IEEE Transactions on Components, Packaging and Manufacturing Technology | - |
| dc.citation.volume | 13 | - |
| dc.contributor.affiliatedAuthor | HONG, WONBIN | - |
| dc.contributor.affiliatedAuthor | Youn, Youngno | - |
| dc.contributor.affiliatedAuthor | Kim,Daehyeon | - |
| dc.contributor.affiliatedAuthor | Chang,Suho | - |
| dc.identifier.scopusid | 2-s2.0-85159827836 | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.type.docType | Article | - |
| dc.subject.keywordAuthor | Absorber | - |
| dc.subject.keywordAuthor | low-profile | - |
| dc.subject.keywordAuthor | low temperature co-fired ceramic (LTCC) fabrication | - |
| dc.subject.keywordAuthor | sub-THz | - |
| dc.subject.keywordAuthor | wideband | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Materials Science | - |
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Related Researcher
- 홍원빈HONG, WONBIN
- Dept of Electrical Enginrg