Single-Step Fabricable Flexible Metadisplays for Sensitive Chemical/Biomedical Packaging Security and Beyond
SCIE
SCOPUS
- Title
- Single-Step Fabricable Flexible Metadisplays for Sensitive Chemical/Biomedical Packaging Security and Beyond
- Authors
- Naveed, Muhammad Ashar; Kim, Joohoon; Ansari, Muhammad Afnan; Kim, Inki; Massoud, Yehia; Kim, Jaekyung; Oh, Dong Kyo; Badloe, Trevon; Lee, Jihae; Kim, Yeseul; Jeon, Dongmin; Choi, Jonghyun; Zubair, Muhammad; Mehmood, Muhammad Qasim; Rho, Junsuk
- Date Issued
- 2022-07
- Publisher
- NLM (Medline)
- Abstract
- Secure packaging and transportation of light-sensitive chemical and biomedical test tubes are crucial for environmental protection and public health. Benefiting from the compact form factor and high efficiency of optical metasurfaces, we propose a broad-band polarization-insensitive flexible metasurface for the security of sensitive packages in the transport industry. We employ both the propagation and the geometric phase of novel TiO2 resin-based anisotropic nanoresonators to demonstrate a flexible and broad-band polarization-insensitive metasurface in the visible domain. The ultraviolet nanoimprint lithographic technique (UV-NIL) is used to fabricate high-index TiO2 nanoparticle-embedded-resin (nano-PER) structures that are patterned on a flexible substrate. This novel approach provides swift single-step fabrication without secondary fabrication steps such as deposition and etching. Moreover, replicating and transforming patterns over flexible substrates make the proposed technique highly suitable for large-throughput commercial manufacturing. As the proposed metahologram manifests high transmission efficiency in the visible domain, such flexible metaholographic platforms could find several exciting applications in bendable/curved displays, wearable devices, and holographic labeling for interactive displays.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/117901
- DOI
- 10.1021/acsami.2c09628
- ISSN
- 1944-8244
- Article Type
- Article
- Citation
- ACS applied materials & interfaces, vol. 14, no. 27, page. 31194 - 31202, 2022-07
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