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Design, Fabrication, and Far-Field Measurement of FoWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications
- Title
- Design, Fabrication, and Far-Field Measurement of FoWLP-based Tightly Coupled Antenna Modules Integrated with CMOS Chipset for mmWave Applications
- Authors
- HONG, WONBIN; Lee, Dongseop; Lee, Jae-Yeong; Lee, Kangseop; Kim, Minkyung; Kim, Myoungsun; Youn, Youngno; Song, Ho-Jin
- Date Issued
- 2023-06-15
- Publisher
- IMS2023
- ISSN
- 0149-645X
- Article Type
- Conference
- Citation
- 2023 IEEE MTT-S International Microwave Symposium, 2023-06-15
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- There are no files associated with this item.
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Related Researcher
- 홍원빈HONG, WONBIN
- Dept of Electrical Enginrg