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dc.contributor.authorSANGHYUN, BAN-
dc.contributor.authorJANGSEOP, LEE-
dc.contributor.authorKim, Taehoon-
dc.contributor.authorHwang, Hyunsang-
dc.date.accessioned2024-03-05T09:11:14Z-
dc.date.available2024-03-05T09:11:14Z-
dc.date.created2024-03-04-
dc.date.issued2023-06-14-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/121032-
dc.description.abstractFor the application of a high-density, low-cost 3D vertical X-point array (V-XPA), we report the characteristics of the atomic layer deposition (ALD) available simple In-Te binary ovonic threshold switch (OTS) and its combination with an HfOx buffer layer. In-Te binary OTS exhibited a highly stable threshold voltage (Vth) and low delta firing voltage (Δ Vff=Vff-Vth) with a low off-leakage current (Ioff) of several nanoamperes, which are the essential requirements for a mega-array. To reduce the high Ioff of the V-XPA, which originates from the perimeter shape selector area, a sub-nanometer ultrathin HfOx buffer layer was successfully applied for the current confinement, yielding an excellent Ioff of 1 nA when combined with the In-Te binary OTS.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.relation.isPartOf2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023-
dc.relation.isPartOfDigest of Technical Papers - Symposium on VLSI Technology-
dc.titleSimple Binary In-Te OTS with Sub-nm HfOxBuffer Layer for 3D Vertical X-point Memory Applications-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitation2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023-
dc.citation.conferenceDate2023-06-11-
dc.citation.conferencePlaceJA-
dc.citation.title2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023-
dc.contributor.affiliatedAuthorSANGHYUN, BAN-
dc.contributor.affiliatedAuthorJANGSEOP, LEE-
dc.contributor.affiliatedAuthorHwang, Hyunsang-
dc.description.journalClass1-
dc.description.journalClass1-

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황현상HWANG, HYUNSANG
Dept of Materials Science & Enginrg
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