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Cited 5 time in webofscience Cited 5 time in scopus
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dc.contributor.authorMin Jin Choi-
dc.contributor.authorKyoung Je Cha-
dc.contributor.authorKim, HW-
dc.contributor.authorMoon-Hee Na-
dc.contributor.authorBong-Kee Lee-
dc.contributor.authorHwang, W-
dc.contributor.authorKim, DS-
dc.date.accessioned2016-03-31T08:05:25Z-
dc.date.available2016-03-31T08:05:25Z-
dc.date.created2013-07-09-
dc.date.issued2013-10-
dc.identifier.issn0167-9317-
dc.identifier.other2013-OAK-0000029817-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/14538-
dc.description.abstractIn this study, a thermoset mold-based hot embossing technique was evaluated for the laboratory-scale replication of thermoplastic surfaces with microchamber/nanodimple (MCND) structures, which enable to construct cell aggregates. Two different types of MCND polystyrene (PS) surfaces of an indented microlens/nanodimple PS surface and an indented micropyramid/nanodimple PS one were replicated by the present hot embossing technique as a proof-of-concept study. In the hot embossing process, two different polyurethane (PU) molds were fabricated from microindented nanodimple-anodic aluminum oxide templates through the UV molding process instead of manufacturing a metal mold. In order to optimize the processing condition of the PU mold-based hot embossing process, a parametric study was carried out based on the Taguchi method. Finally, the PS MCND surfaces replicated under the optimized hot embossing condition were applied to platforms for constructing cell aggregates. (C) 2013 Elsevier B.V. All rights reserved.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE BV-
dc.relation.isPartOfMicroelectronic Engineering-
dc.subjectPolyurethane mold-
dc.subjectHot embossing-
dc.subjectTaguchi method-
dc.subjectPolystyrene-
dc.subjectCell aggregates-
dc.subjectMicrochamber/nanodimple (MCND)-
dc.subjectMicroindented nanodimple-anodic aluminum oxide (MNAAO)-
dc.titleMicrochamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing-
dc.typeArticle-
dc.contributor.college기계공학과-
dc.identifier.doi10.1016/J.MEE.2013.02.049-
dc.author.googleChoi, MJ-
dc.author.googleCha, KJ-
dc.author.googleKim, HW-
dc.author.googleNa, MH-
dc.author.googleLee, BK-
dc.author.googleHwang, W-
dc.author.googleKim, DS-
dc.relation.volume110-
dc.relation.startpage340-
dc.relation.lastpage345-
dc.contributor.id10053430-
dc.relation.journalMICROELECTRONIC ENGINEERING-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationMicroelectronic Engineering, v.110, pp.340 - 345-
dc.identifier.wosid000326003600068-
dc.date.tcdate2019-01-01-
dc.citation.endPage345-
dc.citation.startPage340-
dc.citation.titleMicroelectronic Engineering-
dc.citation.volume110-
dc.contributor.affiliatedAuthorHwang, W-
dc.contributor.affiliatedAuthorKim, DS-
dc.identifier.scopusid2-s2.0-84885182689-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc4-
dc.description.scptc4*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle-
dc.subject.keywordAuthorPolyurethane mold-
dc.subject.keywordAuthorHot embossing-
dc.subject.keywordAuthorTaguchi method-
dc.subject.keywordAuthorPolystyrene-
dc.subject.keywordAuthorCell aggregates-
dc.subject.keywordAuthorMicrochamber/nanodimple (MCND)-
dc.subject.keywordAuthorMicroindented nanodimple-anodic aluminum oxide (MNAAO)-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryOptics-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaOptics-
dc.relation.journalResearchAreaPhysics-

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