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dc.contributor.authorSeonhaeng Lee-
dc.contributor.authorKim, C-
dc.contributor.authorKim, H-
dc.contributor.authorKim, GJ-
dc.contributor.authorSeo, JH-
dc.contributor.authorSon, D-
dc.contributor.authorKang, B-
dc.date.accessioned2016-03-31T08:15:09Z-
dc.date.available2016-03-31T08:15:09Z-
dc.date.created2014-03-04-
dc.date.issued2013-09-
dc.identifier.issn0026-2714-
dc.identifier.other2013-OAK-0000029096-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/14894-
dc.description.abstractThe effect of a low stress voltage on the negative bias temperature instability degradation in a nanoscale p-channel metal-oxide-semiconductor field-effect transistor using high-k/metal gate stacks is investigated. The direct current-current voltage and carrier separation methods are used to separate the effects of electrons and holes. The results indicate that a high stress voltage generates positive oxide charges that degrade the device, but a low stress voltage generates negative oxide charges that induce the turn-around effect of the threshold voltage. (C) 2013 Elsevier Ltd. All rights reserved.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherELESVIER SCIENCE BV-
dc.relation.isPartOfMicroelectronic Reliability-
dc.subjectDIELECTRICS-
dc.subjectDEGRADATION-
dc.subjectTRANSISTORS-
dc.subjectOXIDES-
dc.subjectHFO2-
dc.subjectSI-
dc.titleEffect of negative bias temperature instability induced by a low stress voltage on nanoscale high-k/metal gate pMOSFETs-
dc.typeArticle-
dc.contributor.college전자전기공학과-
dc.identifier.doi10.1016/J.MICROREL.2013.07.026-
dc.author.googleLee, S-
dc.author.googleKim, C-
dc.author.googleKim, H-
dc.author.googleKim, GJ-
dc.author.googleSeo, JH-
dc.author.googleSon, D-
dc.author.googleKang, B-
dc.relation.volume53-
dc.relation.issue9-11-
dc.relation.startpage1351-
dc.relation.lastpage1354-
dc.contributor.id10071834-
dc.relation.journalMicroelectronic Reliability-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationMicroelectronic Reliability, v.53, no.9-11, pp.1351 - 1354-
dc.identifier.wosid000328588000038-
dc.date.tcdate2018-03-23-
dc.citation.endPage1354-
dc.citation.number9-11-
dc.citation.startPage1351-
dc.citation.titleMicroelectronic Reliability-
dc.citation.volume53-
dc.contributor.affiliatedAuthorKang, B-
dc.identifier.scopusid2-s2.0-84886891394-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.scptc0*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle-
dc.subject.keywordPlusDEGRADATION-
dc.subject.keywordPlusDIELECTRICS-
dc.subject.keywordPlusOXIDES-
dc.subject.keywordPlusHFO2-
dc.subject.keywordPlusSI-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaPhysics-

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강봉구KANG, BONG KOO
Dept of Electrical Enginrg
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