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Electroless nanoparticle film deposition compatible with photolithography, microcontact printing, and Dip-Pen nanolithography patterning technologies SCIE SCOPUS
- Title
- Electroless nanoparticle film deposition compatible with photolithography, microcontact printing, and Dip-Pen nanolithography patterning technologies
- Authors
- Porter, LA; Choi, HC; Schmeltzer, JM; Ribbe, AE; Elliott, LCC; Buriak, JM
- Date Issued
- 2002-12
- Publisher
- AMER CHEMICAL SOC
- Abstract
- Nanoparticles of Au, Pd, and Pt form spontaneously as thin, morphologically complex metallic films upon various semiconducting or metal substrates such as Ge(100), Cu, Zn, and Sri, via galvanic displacement from aqueous metal salt solutions. Patterning of these high surface area metal films into ordered structures utilizing photolithography, microcontact printing (mu-CP), and dip-pen nanolithography (DPN) is demonstrated on flat Ge(100), and (for mu-CP) on rough Zn foil.
- Keywords
- SILICON SURFACES; POROUS SILICON; N-TYPE; NANOSTRUCTURES; COPPER; MONOLAYERS; BEHAVIOR; SI(111); NICKEL; DOTS
- ISSN
- 1530-6984
- Article Type
- Article
- Citation
- NANO LETTERS, vol. 2, no. 12, page. 1369 - 1372, 2002-12
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Related Researcher
- 최희철CHOI, HEE CHEUL
- Dept of Chemistry