DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, JS | - |
dc.contributor.author | Zhou, D | - |
dc.contributor.author | Cai, W | - |
dc.contributor.author | Park, SH | - |
dc.contributor.author | Shin, TJ | - |
dc.contributor.author | Oh, W | - |
dc.contributor.author | Lee, SW | - |
dc.contributor.author | Ree, M | - |
dc.date.accessioned | 2016-03-31T13:11:19Z | - |
dc.date.available | 2016-03-31T13:11:19Z | - |
dc.date.created | 2009-03-09 | - |
dc.date.issued | 2001-01 | - |
dc.identifier.issn | 1058-725X | - |
dc.identifier.other | 2002-OAK-0000002384 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/19266 | - |
dc.description.abstract | For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4'-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | TAYLOR & FRANCIS LTD | - |
dc.relation.isPartOf | MOLECULAR CRYSTALS AND LIQUID CRYSTALS | - |
dc.subject | epoxy resin waterborne | - |
dc.subject | blocked isocyanate | - |
dc.subject | residual stress | - |
dc.subject | deblocking reaction | - |
dc.subject | curing reaction | - |
dc.subject | network formation | - |
dc.subject | THIN-FILMS | - |
dc.subject | SHRINKAGE | - |
dc.subject | CURE | - |
dc.title | FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne | - |
dc.type | Article | - |
dc.contributor.college | BK분자과학사업단 | - |
dc.identifier.doi | 10.1080/10587250108024760 | - |
dc.author.google | Yu, JS | - |
dc.author.google | Zhou, D | - |
dc.author.google | Cai, W | - |
dc.author.google | Park, SH | - |
dc.author.google | Shin, TJ | - |
dc.author.google | Oh, W | - |
dc.author.google | Lee, SW | - |
dc.author.google | Ree, M | - |
dc.relation.volume | 371 | - |
dc.relation.startpage | 359 | - |
dc.relation.lastpage | 364 | - |
dc.contributor.id | 10115761 | - |
dc.relation.journal | MOLECULAR CRYSTALS AND LIQUID CRYSTALS | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | MOLECULAR CRYSTALS AND LIQUID CRYSTALS, v.371, pp.359 - 364 | - |
dc.identifier.wosid | 000172816400089 | - |
dc.date.tcdate | 2017-12-04 | - |
dc.citation.endPage | 364 | - |
dc.citation.startPage | 359 | - |
dc.citation.title | MOLECULAR CRYSTALS AND LIQUID CRYSTALS | - |
dc.citation.volume | 371 | - |
dc.contributor.affiliatedAuthor | Ree, M | - |
dc.identifier.scopusid | 2-s2.0-31944433151 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.subject.keywordPlus | SHRINKAGE | - |
dc.subject.keywordPlus | CURE | - |
dc.subject.keywordAuthor | epoxy resin waterborne | - |
dc.subject.keywordAuthor | blocked isocyanate | - |
dc.subject.keywordAuthor | residual stress | - |
dc.subject.keywordAuthor | deblocking reaction | - |
dc.subject.keywordAuthor | curing reaction | - |
dc.subject.keywordAuthor | network formation | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Crystallography | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Crystallography | - |
dc.relation.journalResearchArea | Materials Science | - |
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