Adhesion strength and mechanism of poly(imide-siloxane) to Alloy 42 leadframe
SCIE
SCOPUS
- Title
- Adhesion strength and mechanism of poly(imide-siloxane) to Alloy 42 leadframe
- Authors
- Kang, JH; Cho, K; Park, CE
- Date Issued
- 2001-01
- Publisher
- VSP BV
- Abstract
- Poly(imide-siloxane) containing alpha,omega-(aminophenoxypropyl)poly(dimethylsiloxane) and alpha,omega-(aminophenoxypropyl)poly(dimethylsiloxane-co-diphenylsiloxane) were synthesized. The adhesion strength of poly(imide-siloxane)/Alloy 42 leadframe (Fe-Ni alloy, 58% Fe and 42% Ni) joints was studied as a function of the molding temperature, time, pressure, and chemical structure of siloxane diamine (SDA). The thermo-oxidative decomposition of polydimethylsiloxane (PDMS) in poly(imide-siloxane) was examined by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR). Silanol groups were formed from the thermal decomposition of PDMS above 300 degreesC. The adhesion mechanism of poly(imide-siloxane) with metal oxide was identified as the formation of covalent bonds between the silanol group of thermo-oxidatively decomposed PDMS and hydroxy groups of the metal oxide by time-of-flight secondary ion mass spectroscopy (TOF-SIMS).
- Keywords
- poly(imide-siloxane); lead-on-chip (LOC) packaging; adhesion strength; attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR); X-ray photoelectron spectroscopy (XPS); time-of-flight secondary ion mass spectroscopy (TOF-SIMS); POLYIMIDE; BEHAVIOR
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/19336
- DOI
- 10.1163/15685610152542360
- ISSN
- 0169-4243
- Article Type
- Article
- Citation
- JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 15, no. 8, page. 913 - 928, 2001-01
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