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Adhesion strength and mechanism of poly(imide-siloxane) to Alloy 42 leadframe SCIE SCOPUS

Title
Adhesion strength and mechanism of poly(imide-siloxane) to Alloy 42 leadframe
Authors
Kang, JHCho, KPark, CE
Date Issued
2001-01
Publisher
VSP BV
Abstract
Poly(imide-siloxane) containing alpha,omega-(aminophenoxypropyl)poly(dimethylsiloxane) and alpha,omega-(aminophenoxypropyl)poly(dimethylsiloxane-co-diphenylsiloxane) were synthesized. The adhesion strength of poly(imide-siloxane)/Alloy 42 leadframe (Fe-Ni alloy, 58% Fe and 42% Ni) joints was studied as a function of the molding temperature, time, pressure, and chemical structure of siloxane diamine (SDA). The thermo-oxidative decomposition of polydimethylsiloxane (PDMS) in poly(imide-siloxane) was examined by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR). Silanol groups were formed from the thermal decomposition of PDMS above 300 degreesC. The adhesion mechanism of poly(imide-siloxane) with metal oxide was identified as the formation of covalent bonds between the silanol group of thermo-oxidatively decomposed PDMS and hydroxy groups of the metal oxide by time-of-flight secondary ion mass spectroscopy (TOF-SIMS).
Keywords
poly(imide-siloxane); lead-on-chip (LOC) packaging; adhesion strength; attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR); X-ray photoelectron spectroscopy (XPS); time-of-flight secondary ion mass spectroscopy (TOF-SIMS); POLYIMIDE; BEHAVIOR
URI
https://oasis.postech.ac.kr/handle/2014.oak/19336
DOI
10.1163/15685610152542360
ISSN
0169-4243
Article Type
Article
Citation
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 15, no. 8, page. 913 - 928, 2001-01
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조길원CHO, KIL WON
Dept. of Chemical Enginrg
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