Adhesion strength of poly(imide-siloxane) with Alloy 42 lead frame and silicon dioxide
SCIE
SCOPUS
- Title
- Adhesion strength of poly(imide-siloxane) with Alloy 42 lead frame and silicon dioxide
- Authors
- Kang, JH; Cho, K; Park, CE
- Date Issued
- 2001-03
- Publisher
- ELSEVIER SCI LTD
- Abstract
- Poly(imide-siloxane) passivation layer was investigated for tapeless lead-on-chip (LOC) packaging. Various molecular weights of siloxane diamine (SDA), alpha,omega-(aminophenoxypropyl)-poly(dimethylsiloxane) were synthesized and incorporated to synthesize poly(imide-siloxane). Effects of molecular weight and content of SDA on the adhesion strength of poly(imide-siloxane) with Alloy 42 lead frame and silicon dioxide were studied. Poly(imide-siloxane) having high molecular weight of SDA showed good adhesion strength with Alloy 42 lead frame. On the other hand, poly(imide-siloxane) having low molecular weight of SDA showed good adhesion strength with silicon dioxide. Therefore, blends of poly(imide-siloxane) having high and low molecular weight of SDA showed good adhesion strength with both Alloy 42 lead frame and silicon dioxide. The origin of different adhesion behavior of poly(imide-siloxane) depending upon the molecular weight of SDA with Alloy 42 lead frame and silicon dioxide was examined by contact angle measurement and X-ray photoelectron spectroscopy (XPS). (C) 2000 Published by Elsevier Science Ltd.
- Keywords
- poly(imide-siloxane); lead-on-chip packaging; adhesion strength; POLYIMIDE; COPOLYMERS
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/19745
- DOI
- 10.1016/S0032-3861(00)00548-6
- ISSN
- 0032-3861
- Article Type
- Article
- Citation
- POLYMER, vol. 42, no. 6, page. 2513 - 2520, 2001-03
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- There are no files associated with this item.
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