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Selective wet etching of GaAs on Al0.24Ga0.76As for GaAs/Al0.24Ga0.76As/In0.22Ga0.78As PHEMT SCIE SCOPUS

Title
Selective wet etching of GaAs on Al0.24Ga0.76As for GaAs/Al0.24Ga0.76As/In0.22Ga0.78As PHEMT
Authors
Lee, JLMoon, EAOh, JWRyu, SWYoo, HM
Date Issued
2000-11-09
Publisher
IEE-INST ELEC ENG
Abstract
A selective etching solution of GaAs over Al0.24Ga0.76As, composed of acid-buffer solution (citric acid monohydrate + potassium citrate) and H2O2. has been developed for GaAs/Al0.24Ga0.76As/In0.22Ga0.78As PHEMT applications. The best selectivity of 776 was achieved using the mixed solution (citric acid-buffer solution:H2O2 = 5:1). The etch rate of GaAs in the solution is as low as 46.6 Angstrom /s. Both the low etch rate of GaAs and the high selectivity exhibit the standard deviation of pinch-off voltage of 1.0 mum-gate PHEMTs as low as +/-0.029V across a 3 in wafer. This demonstrates the applicability of this solution to the gate recess process.
Keywords
HETEROSTRUCTURE
URI
https://oasis.postech.ac.kr/handle/2014.oak/19784
DOI
10.1049/el:20001337
ISSN
0013-5194
Article Type
Article
Citation
ELECTRONICS LETTERS, vol. 36, no. 23, page. 1974 - 1975, 2000-11-09
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이종람LEE, JONG LAM
Dept of Materials Science & Enginrg
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