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Cited 2 time in webofscience Cited 5 time in scopus
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dc.contributor.authorLee, JL-
dc.contributor.authorKim, H-
dc.contributor.authorMun, JK-
dc.contributor.authorMaeng, SJ-
dc.date.accessioned2016-03-31T13:52:24Z-
dc.date.available2016-03-31T13:52:24Z-
dc.date.created2009-02-28-
dc.date.issued1998-07-
dc.identifier.issn0741-3106-
dc.identifier.other1998-OAK-0000000271-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/20743-
dc.description.abstractGaAs power MESFET's with 0.5-mu m T-shaped gate for Ku-band power applications have been developed using a new self-aligned and optical lithography, It displays a maximum current density of 350 mA/mm, an uniform transconductance of 150 mS/mm and a high gate-to-drain breakdown voltage of 35 V. Both the high breakdown voltage and the uniform transconductance were achieved by the new MESFET design incorporating an undoped GaAs cap and a thick lightly doped active layers. The breakdown voltage is the highest one among the values reported on the power devices. The device exhibits 0.61 W/mm power density and 47% power added efficiency with 9.0 dB associated gain at a drain bias of 12 V and an operation frequency of 12 GHz.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGI-
dc.relation.isPartOfIEEE ELECTRON DEVICE LETTERS-
dc.subjectHEMTS-
dc.titleA Ku-band T-shaped gate GaAs power MESFET with high breakdown voltage for satellite communications-
dc.typeArticle-
dc.contributor.college신소재공학과-
dc.identifier.doi10.1109/55.701433-
dc.author.googleLEE, JL-
dc.author.googleKIM, H-
dc.author.googleMUN, JK-
dc.author.googleMAENG, SJ-
dc.relation.volume19-
dc.relation.issue7-
dc.relation.startpage250-
dc.relation.lastpage252-
dc.contributor.id10105416-
dc.relation.journalIEEE ELECTRON DEVICE LETTERS-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationIEEE ELECTRON DEVICE LETTERS, v.19, no.7, pp.250 - 252-
dc.identifier.wosid000074366900013-
dc.date.tcdate2019-01-01-
dc.citation.endPage252-
dc.citation.number7-
dc.citation.startPage250-
dc.citation.titleIEEE ELECTRON DEVICE LETTERS-
dc.citation.volume19-
dc.contributor.affiliatedAuthorLee, JL-
dc.identifier.scopusid2-s2.0-0032123104-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc2-
dc.type.docTypeArticle-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-

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이종람LEE, JONG LAM
Dept of Materials Science & Enginrg
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