DC Field | Value | Language |
---|---|---|
dc.contributor.author | Song, SM | - |
dc.contributor.author | Park, CE | - |
dc.contributor.author | Yun, HK | - |
dc.contributor.author | Hwang, CS | - |
dc.contributor.author | Oh, SY | - |
dc.contributor.author | Park, JM | - |
dc.date.accessioned | 2016-03-31T13:52:54Z | - |
dc.date.available | 2016-03-31T13:52:54Z | - |
dc.date.created | 2009-03-17 | - |
dc.date.issued | 1998-01 | - |
dc.identifier.issn | 0169-4243 | - |
dc.identifier.other | 1998-OAK-0000000244 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/20758 | - |
dc.description.abstract | The adhesion strength of epoxy resin/copper joints is often very poor, due to the naturally formed copper oxide having a low mechanical strength. To improve the adhesion strength of epoxy resin/copper lead frame joints, copper lead frames were created with azole compounds as adhesion promoters. The azole compounds used were benzotriazole (BTA), benzotriazole-5-carboxylic acid (CBTA), 8-azaadenine, imidazole, 2-methyl imidazole, urocanic acid, adenine, benzimidazole, and polybenzimidazole (PBI). The dependence of the adhesion strength of epoxy resin/azole-treated copper joints on the structure of the azole compound. the azole treatment time, and the azole treatment temperature was investigated. The surface coverage of azole-treated copper was examined by contact angle measurements, a surface defect test, optical microscopy, and scanning electron microscopy (SEM), and the locus of failure was studied by X-ray photoelectron spectroscopy (XPS). Triazole compounds such as CBTA and 8-azaadenine showed excellent adhesion strength; imidazole-based azole compounds did not improve the adhesion strength. However, the adhesion strength of CBTA- and 8-azaadenine-treated joints decreased with increasing treatment time, since thick porous Cu-azole complexes had a weaker mechanical strength when formed. The polymeric azole compound PBI showed the highest adhesion strength, 785 N/m, because of complete coverage of the copper surface. The thermal stability of azole compounds and epoxy resin/azole-treated copper joints was also investigated. CBTA and 8-azaadenine did not decompose up to 250 degrees C, while PBI was stable up to 500 degrees C in an air atmosphere. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | VSP BV | - |
dc.relation.isPartOf | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
dc.subject | adhesion strength | - |
dc.subject | epoxy resin | - |
dc.subject | copper | - |
dc.subject | triazole | - |
dc.subject | polybenzimidazole | - |
dc.subject | Cu-azole complex | - |
dc.subject | CORROSION INHIBITOR | - |
dc.subject | BENZOTRIAZOLE | - |
dc.title | Adhesion improvement of epoxy resin copper lead frame joints by azole compounds | - |
dc.type | Article | - |
dc.contributor.college | 화학공학과 | - |
dc.identifier.doi | 10.1163/156856198X00218 | - |
dc.author.google | Song, SM | - |
dc.author.google | Park, CE | - |
dc.author.google | Yun, HK | - |
dc.author.google | Hwang, CS | - |
dc.author.google | Oh, SY | - |
dc.author.google | Park, JM | - |
dc.relation.volume | 12 | - |
dc.relation.issue | 5 | - |
dc.relation.startpage | 541 | - |
dc.relation.lastpage | 561 | - |
dc.contributor.id | 10104044 | - |
dc.relation.journal | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.12, no.5, pp.541 - 561 | - |
dc.identifier.wosid | 000074002800006 | - |
dc.date.tcdate | 2019-01-01 | - |
dc.citation.endPage | 561 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | 541 | - |
dc.citation.title | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
dc.citation.volume | 12 | - |
dc.contributor.affiliatedAuthor | Park, CE | - |
dc.identifier.scopusid | 2-s2.0-0031697863 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 24 | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | adhesion strength | - |
dc.subject.keywordAuthor | epoxy resin | - |
dc.subject.keywordAuthor | copper | - |
dc.subject.keywordAuthor | triazole | - |
dc.subject.keywordAuthor | polybenzimidazole | - |
dc.subject.keywordAuthor | Cu-azole complex | - |
dc.relation.journalWebOfScienceCategory | Engineering, Chemical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Mechanics | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Mechanics | - |
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