Metalorganic chemical vapor deposition of nickel films from Ni(C5H5)(2)/H-2
SCIE
SCOPUS
- Title
- Metalorganic chemical vapor deposition of nickel films from Ni(C5H5)(2)/H-2
- Authors
- Kang, JK; Rhee, SW
- Date Issued
- 2000-08
- Publisher
- MATERIALS RESEARCH SOCIETY
- Abstract
- Nickel thin films were deposited with Ni(C5H5)(2) [NiCp2, bis(cyclopentadienyl)nickel, nickelocene]/H-2 at various temperatures and H-2/Ar ratios. The deposition rate, resistivity, purity, crystal structure, and surface morphology of the nickel film were investigated. Also, thermal analysis was done to find out the dissociation characteristics of NiCp2, and Fourier transform infrared spectroscopy diagnostics were carried out to study the gas phase reaction kinetics of NiCp2. Nickel films deposited at higher temperatures (>225 degrees C) had high carbon content and high resistivity. At higher temperatures, thermal decomposition of NiCp2 and subsequent decomposition of Cp induced a large amount of carbon incorporation into the film. At lower temperatures (<190 degrees C), the slow dissociation of NiCp led to some extent of carbon incorporation in the film. Nickel films deposited at around 200 degrees C showed carbon content lower than 5% and lower resistivity because of the effective dissociation of Ni-Cp and desorption of Cp from the surface. Nickel films deposited with hydrogen addition showed higher purity, crystallinity, and lower resistivity due to the removal of the carbon on the surface.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/21019
- DOI
- 10.1557/JMR.2000.0264
- ISSN
- 0884-2914
- Article Type
- Article
- Citation
- JOURNAL OF MATERIALS RESEARCH, vol. 15, no. 8, page. 1828 - 1833, 2000-08
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.