Creep densification of copper powder compact
SCIE
SCOPUS
- Title
- Creep densification of copper powder compact
- Authors
- Song, MC; Kim, HG; Kim, KT
- Date Issued
- 1996-11
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Abstract
- Densification of metal powder under high temperature processing was investigated. Experimental data were obtained for copper powder under hot isostatic pressing, hot pressing and uniaxial creep compression. Theoretical calculations from the constitutive models by McMeeking and co-workers were compared with the experimental data. The agreements between experimental data and theoretical calculations are reasonably good when hydrostatic stress is dominant, but not as good when deviatoric stress increases. Copyright (C) 1996 Elsevier Science Ltd.
- Keywords
- creep; powder; compact; hot pressing; hot isostatic pressing; densification; ISOLATED CONTACTS
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/21539
- DOI
- 10.1016/0020-7403(96)00011-2
- ISSN
- 0020-7403
- Article Type
- Article
- Citation
- INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, vol. 38, no. 11, page. 1197 - 1208, 1996-11
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- There are no files associated with this item.
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