EFFECTS OF THE IMIDIZATION TEMPERATURE OF POLY(IMIDE-SILOXANE) ON THE ADHESION STRENGTH OF EPOXY-RESIN POLY(IMIDE-SILOXANE) JOINTS

Abstract

The effects of the imidization temperature of poly(imide-siloxane) on the adhesion strength of epoxy resin/poly(imide-siloxane) joints were studied. The effects of the content and molecular weight of polydimethylsiloxane in poly(imide-siloxane) on the adhesion strength were also examined with samples of pyromellitic dianhydride-4,4'-oxydianiline (PMDA-ODA) containing various amounts and molecular weights of aminopropyl-terminated polydimethylsiloxane (SDA). The adhesion strength increased with increasing imidization temperature in the air environment and was found to be sensitive to the content and molecular weight of SDA. The adhesion mechanism of epoxy resin/poly(imide-siloxane) joints was investigated using various analytical techniques. The failure mode of the joint was found to be cohesive in the poly(imide-siloxane) layer very close to the interface.