ADHESION IMPROVEMENT OF COPPER EPOXY JOINTS
SCIE
SCOPUS
- Title
- ADHESION IMPROVEMENT OF COPPER EPOXY JOINTS
- Authors
- AN, JH; CHO, K; PARK, CE; YUN, HK
- Date Issued
- 1992-11-01
- Publisher
- KLUWER ACADEMIC PUBL
- Abstract
- Copper oxides have been formed to improve the adhesive strength of copper/epoxy joints. Initial adhesive strength and durability of copper/epoxy joints were compared depending upon the type of oxides, black or red oxide. Although the initial adhesive strength of black oxide treated joints was worse than that of red oxide treated joints, the durability in acidic environment was better. In order to improve the durability of red oxide treated joints, 5-amino-indazole was applied to inhibit the corrosion of oxide layer in acidic medium. With the treatment of 5-amino-indazole, initial adhesive strength was increased by 50%, and durability was improved. The loci of failure for oxide treated joints were investigated with scanning electron microscope and X-ray photoelectron spectroscopy.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/22150
- DOI
- 10.1007/BF01119743
- ISSN
- 0022-2461
- Article Type
- Article
- Citation
- JOURNAL OF MATERIALS SCIENCE, vol. 27, no. 21, page. 5811 - 5817, 1992-11-01
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.