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Effects of 2-amino-5-ethylthio-1,3,4-thiadiazole on copper corrosion as a corrosion inhibitor in aerated acidic pickling solutions SCIE SCOPUS

Title
Effects of 2-amino-5-ethylthio-1,3,4-thiadiazole on copper corrosion as a corrosion inhibitor in aerated acidic pickling solutions
Authors
Sherif, EMPark, SM
Date Issued
2006-09-15
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Abstract
Effects of 2-amino-5-ethylthio-1,3,4-thiadiazole (AETD) on copper corrosion as a corrosion inhibitor in an aerated acidic pickling solution of 0.50 M HCl have been investigated using gravimetric and electrochemical techniques. Weight losses of copper coupons in 0.50 M HCl measured after varied exposure periods of 2-12 h indicate that the addition of AETD significantly decreases the dissolution rate and the effect increases upon increasing its concentration. Results of potentiodynamic polarization experiments show a large decrease in cathodic, anodic, and corrosion currents due to the presence of the organic molecules. Potentiostatic current-time measurements at 200 mV versus Ag/AgCl for 120 min, scanning electron microscope (SEM), and energy dispersive X-ray (EDX) investigations also indicate that AETD greatly lowers the dissolution currents as a result of its strong adsorption onto the copper surface preventing it from being corroded easily. EIS measurements confirmed that the charge transfer resistance increases and mass transport decreases in the presence of AETD upon increasing its concentration. (c) 2006 Elsevier Ltd. All rights reserved.
Keywords
aerated acidic pickling solutions; copper corrosion; corrosion inhibitors; 2-amino-5-(ethylthio)-1,3,4-thiadiazole; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; SELF-ASSEMBLED MONOLAYER; SODIUM-CHLORIDE SOLUTIONS; HYDROCHLORIC-ACID; HETEROCYCLIC-COMPOUNDS; ALKALINE-SOLUTIONS; ANODIC-OXIDATION; IRON ELECTRODES; ZINC ELECTRODEPOSITION; CHEMICAL-MODIFICATION
URI
https://oasis.postech.ac.kr/handle/2014.oak/23803
DOI
10.1016/j.electacta.2006.04.047
ISSN
0013-4686
Article Type
Article
Citation
ELECTROCHIMICA ACTA, vol. 51, no. 28, page. 6556 - 6562, 2006-09-15
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