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Novel X-ray diffraction microscopy technique for measuring textured grains of thin-films SCIE SCOPUS

Title
Novel X-ray diffraction microscopy technique for measuring textured grains of thin-films
Authors
Yi, JMJe, JHChu, YSCullen, WGYou, H
Date Issued
2005-10-01
Publisher
ELSEVIER SCIENCE BV
Abstract
We introduce a new X-ray diffraction microscopy technique capable of coupling grain orientation with its spatial location in textured thin-films. The principle is based on the combination of X-ray topography with diffractometry. High-resolution X-ray diffractometry using a scintillation detector is utilized to measure orientational distribution of individual grains. Then X-ray topography using CCD system is applied to determine the spatial locations of the angularly resolved grains. The successful application is demonstrated for grain-on-grain epitaxial alignment between the film and the substrate in Y2O3/Ni. The feasibility and the limitations of the technique are discussed. (c) 2005 Elsevier B.V. All rights reserved.
Keywords
X-ray diffraction; X-ray topography; textured grain; COATED CONDUCTORS; MICROSTRUCTURE; DEFORMATION; DIMENSIONS; GROWTH
URI
https://oasis.postech.ac.kr/handle/2014.oak/24360
DOI
10.1016/j.nima.2005.07.064
ISSN
0168-9002
Article Type
Article
Citation
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, vol. 551, no. 1, page. 157 - 161, 2005-10-01
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제정호JE, JUNG HO
Dept of Materials Science & Enginrg
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