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Cited 35 time in webofscience Cited 27 time in scopus
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dc.contributor.authorYang, W-
dc.contributor.authorYoung Gyu Nam-
dc.contributor.authorBong-Kee Lee-
dc.contributor.authorKyungsup Han-
dc.contributor.authorTai Hun Kwon-
dc.contributor.authorKim, DS-
dc.date.accessioned2016-04-01T02:23:00Z-
dc.date.available2016-04-01T02:23:00Z-
dc.date.created2010-12-06-
dc.date.issued2010-01-
dc.identifier.issn0021-4922-
dc.identifier.other2010-OAK-0000022906-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/25029-
dc.description.abstractIn this paper, we present a simple and low-cost fabrication technique of a novel hydrophilic poly(dimethylsiloxane) (PDMS) microporous structure (or microsponge) based on a modified sugar leaching technique. A surfactant, Silwet L-77 enabled us to achieve the wettability conversion of PDMS from hydrophobic to hydrophilic. The wettability changes of PDMS surfaces and microsponges were characterized at various weight percentages of Silwet L-77 and it was found that a hydrophilic PDMS microsponge containing 0.6% of Silwet L-77 rapidly absorbed water droplets. The average porosity of the fabricated PDMS microsponges was measured as 0.55. We have successfully demonstrated the hydrophilic PDMS microsponge as a portable pump for a microfluidic device. The hydrophilic PDMS microsponge was firmly bonded at the inlet of a PDMS microchannel via oxygen plasma treatment. A water-phase sample was easily loaded into the hydrophilic PDMS microsponge and it was released and injected into the microchannel by simply pushing the microsponge. (C) 2010 The Japan Society of Applied Physics-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherJAPAN SOC APPLIED PHYSICS-
dc.relation.isPartOfJAPANESE JOURNAL OF APPLIED PHYSICS-
dc.subjectMICROPUMP-
dc.subjectSILICON-
dc.subjectSYSTEMS-
dc.subjectLAYER-
dc.titleFabrication of a Hydrophilic Poly(dimethylsiloxane) Microporous Structure and Its Application to Portable Microfluidic Pump-
dc.typeArticle-
dc.contributor.college기계공학과-
dc.identifier.doi10.1143/JJAP.49.06GM01-
dc.author.googleYang, W-
dc.author.googleNam, YG-
dc.author.googleLee, BK-
dc.author.googleHan, K-
dc.author.googleKwon, TH-
dc.author.googleKim, DS-
dc.relation.volume49-
dc.relation.issue6-
dc.relation.startpage06GM01-
dc.contributor.id10170232-
dc.relation.journalJapanese Journal of Applied Physics-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationJAPANESE JOURNAL OF APPLIED PHYSICS, v.49, no.6-
dc.identifier.wosid000278966300100-
dc.date.tcdate2019-02-01-
dc.citation.number6-
dc.citation.titleJAPANESE JOURNAL OF APPLIED PHYSICS-
dc.citation.volume49-
dc.contributor.affiliatedAuthorKim, DS-
dc.identifier.scopusid2-s2.0-77955340497-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc24-
dc.description.scptc13*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle; Proceedings Paper-
dc.subject.keywordPlusMICROPUMP-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusSYSTEMS-
dc.subject.keywordPlusLAYER-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-

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김동성KIM, DONG SUNG
Dept of Mechanical Enginrg
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