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Cited 12 time in webofscience Cited 17 time in scopus
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dc.contributor.authorKim, BI-
dc.contributor.authorJeong, S-
dc.contributor.authorShin, J-
dc.contributor.authorKoo, J-
dc.contributor.authorChae, J-
dc.contributor.authorLee, S-
dc.date.accessioned2016-04-01T03:24:38Z-
dc.date.available2016-04-01T03:24:38Z-
dc.date.created2010-03-15-
dc.date.issued2009-05-
dc.identifier.issn0894-6507-
dc.identifier.other2009-OAK-0000020165-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/26554-
dc.description.abstractSimulation has drawn much attention as an analysis tool because it is often the only tool that has the capability of modeling the details of the semiconductor lines. However, building a simulation model of a semiconductor line is time-consuming and error-prone because of the complexity of the line. This paper proposes a generic simulation modeling framework to reduce the simulation model build time. The framework consists of a layout modeling software called AutoLay and a data-driven generic simulation model called AutoLogic. It can be used to develop an integrated simulation model of production processes and material handling processes in a short period of time. Early users of our framework reported that the initial model building time was reduced from two weeks to a half day.-
dc.description.statementofresponsibilityX-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.relation.isPartOfIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING-
dc.subjectAutomated material handling system-
dc.subjectAutoMod-
dc.subjectgeneric simulation model-
dc.subjectlayout-
dc.subjectWAFER-FAB-
dc.subjectSYSTEMS-
dc.subjectOPTIMIZATION-
dc.subjectDESIGN-
dc.subjectAMHS-
dc.subjectTOOL-
dc.titleA Layout- and Data-Driven Generic Simulation Model for Semiconductor Fabs-
dc.typeArticle-
dc.contributor.college산업경영공학과-
dc.identifier.doi10.1109/TSM.2009.2017624-
dc.author.googleKim, BI-
dc.author.googleJeong, S-
dc.author.googleShin, J-
dc.author.googleKoo, J-
dc.author.googleChae, J-
dc.author.googleLee, S-
dc.relation.volume22-
dc.relation.issue2-
dc.relation.startpage225-
dc.relation.lastpage231-
dc.contributor.id10135658-
dc.relation.journalIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING-
dc.relation.indexSCI급, SCOPUS 등재논문-
dc.relation.sciSCI-
dc.collections.nameJournal Papers-
dc.type.rimsART-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.22, no.2, pp.225 - 231-
dc.identifier.wosid000265935900002-
dc.date.tcdate2019-02-01-
dc.citation.endPage231-
dc.citation.number2-
dc.citation.startPage225-
dc.citation.titleIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING-
dc.citation.volume22-
dc.contributor.affiliatedAuthorKim, BI-
dc.identifier.scopusid2-s2.0-67649289939-
dc.description.journalClass1-
dc.description.journalClass1-
dc.description.wostc8-
dc.description.scptc12*
dc.date.scptcdate2018-05-121*
dc.type.docTypeArticle-
dc.subject.keywordPlusOPTIMIZATION-
dc.subject.keywordPlusSYSTEMS-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusAMHS-
dc.subject.keywordPlusTOOL-
dc.subject.keywordAuthorAutomated material handling system-
dc.subject.keywordAuthorAutoMod-
dc.subject.keywordAuthorgeneric simulation model-
dc.subject.keywordAuthorlayout-
dc.relation.journalWebOfScienceCategoryEngineering, Manufacturing-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-

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