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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ahn, SI | - |
| dc.contributor.author | Kim, JH | - |
| dc.contributor.author | null | - |
| dc.date.accessioned | 2016-04-01T03:33:04Z | - |
| dc.date.available | 2016-04-01T03:33:04Z | - |
| dc.date.issued | 2009-01 | - |
| dc.identifier.citation | JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | - |
| dc.identifier.citation | v.22 | - |
| dc.identifier.citation | no.6 | - |
| dc.identifier.citation | pp.747-752 | - |
| dc.identifier.issn | 0914-9244 | - |
| dc.identifier.other | 2010-OAK-0000020053 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/26593 | - |
| dc.description.abstract | Vertical electron density profiles of various photoresist, top-coat and their combinations as bilayers were obtained from X-ray reflectivity analysis. The result suggests that there are specific layers with different electron density near the surface of photoresists and top-coats films. The investigation on bilayer films which consist of photoresist and top-coat shows that the intermixing of two materials and the roughness of films are varied by annealing (baking) time and temperature. | - |
| dc.description.statementofresponsibility | X | - |
| dc.publisher | TECHNICAL ASSOC PHOTOPOLYMERS,JAPAN | - |
| dc.subject | immersion lithography | - |
| dc.subject | photoresist | - |
| dc.subject | top-coat | - |
| dc.subject | X-ray reflectivity | - |
| dc.title | Vertical Density Profiles of Various Photoresists and Top-coats by X-ray Reflectivity Analysis | - |
| dc.type | Article | - |
| dc.author.google | Ahn, SI | - |
| dc.author.google | Kim, JH | - |
| dc.relation.volume | 22 | - |
| dc.relation.issue | 6 | - |
| dc.relation.startpage | 747 | - |
| dc.relation.lastpage | 752 | - |
| dc.publisher.location | JA | - |
| dc.relation.journal | JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | - |
| dc.relation.index | SCI급, SCOPUS 등재논문 | - |
| dc.relation.sci | SCIE | - |
| dc.collections.name | Journal Papers | - |
| dc.type.docType | Article | - |
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