DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, M | - |
dc.contributor.author | Sim, JY | - |
dc.contributor.author | Park, HJ | - |
dc.contributor.author | KIM, BYUNGSUB | - |
dc.date.accessioned | 2016-04-01T07:48:05Z | - |
dc.date.available | 2016-04-01T07:48:05Z | - |
dc.date.created | 2016-02-22 | - |
dc.date.issued | 2015-05 | - |
dc.identifier.issn | 1549-8328 | - |
dc.identifier.other | 2015-OAK-0000033079 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/26887 | - |
dc.description.abstract | This paper presents an approximate closed-form transfer function model for diverse differential interconnects. The proposed model is simple, intuitive, and can accurately describe various interconnects satisfying the validity conditions which theoretically bound the approximation error. The proposed model also provides a conceptual circuit representation by analogy with an equivalent circuit model of a single-ended interconnect. The model's accuracy is verified by comparing calculated through-and crosstalk-transfer functions against w-element SPICE simulation results for various LC-dominant and RC-dominant interconnects. Our analysis also empirically verifies that the approximation error is bounded by the validity parameters. In addition, the computation time is improved by about 157 times compared to that of the previous numerical computation method built-in SPICE simulator. With the proposed channel model, designers can easily understand and analyze the behaviors of various differential interconnects without complex analysis. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.relation.isPartOf | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS | - |
dc.title | An Approximate Closed-Form Transfer Function Model for Diverse Differential Interconnects | - |
dc.type | Article | - |
dc.contributor.college | 전자전기공학과 | - |
dc.identifier.doi | 10.1109/TCSI.2015.2407435 | - |
dc.author.google | Choi, M | - |
dc.author.google | Sim, JY | - |
dc.author.google | Park, HJ | - |
dc.author.google | Kim, B | - |
dc.relation.volume | 62 | - |
dc.relation.issue | 5 | - |
dc.relation.startpage | 1335 | - |
dc.relation.lastpage | 1344 | - |
dc.contributor.id | 10100874 | - |
dc.relation.journal | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS | - |
dc.relation.sci | SCI | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.62, no.5, pp.1335 - 1344 | - |
dc.identifier.wosid | 000353887300014 | - |
dc.date.tcdate | 2019-02-01 | - |
dc.citation.endPage | 1344 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | 1335 | - |
dc.citation.title | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS | - |
dc.citation.volume | 62 | - |
dc.contributor.affiliatedAuthor | Sim, JY | - |
dc.contributor.affiliatedAuthor | Park, HJ | - |
dc.contributor.affiliatedAuthor | KIM, BYUNGSUB | - |
dc.identifier.scopusid | 2-s2.0-84928963507 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 6 | - |
dc.description.scptc | 2 | * |
dc.date.scptcdate | 2018-05-121 | * |
dc.type.docType | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | Crosstalk | - |
dc.subject.keywordAuthor | differential transmission line | - |
dc.subject.keywordAuthor | interconnect model | - |
dc.subject.keywordAuthor | on-chip wire | - |
dc.subject.keywordAuthor | printed circuit board | - |
dc.subject.keywordAuthor | signal integrity | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
library@postech.ac.kr Tel: 054-279-2548
Copyrights © by 2017 Pohang University of Science ad Technology All right reserved.