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Cited 91 time in webofscience Cited 99 time in scopus
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Push the Envelope SCIE SCOPUS

Title
Push the Envelope
Authors
Kim, BKim, JKim, DSon, JCho, YKim, JPark, B
Date Issued
2013-05
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
URI
https://oasis.postech.ac.kr/handle/2014.oak/27136
DOI
10.1109/MMM.2013.2240851
ISSN
1527-3342
Article Type
Article
Citation
IEEE MICROWAVE MAGAZINE, vol. 14, no. 3, page. 68 - 81, 2013-05
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김범만KIM, BUM MAN
Dept of Electrical Enginrg
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