Push the Envelope
SCIE
SCOPUS
- Title
- Push the Envelope
- Authors
- Kim, B; Kim, J; Kim, D; Son, J; Cho, Y; Kim, J; Park, B
- Date Issued
- 2013-05
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/27136
- DOI
- 10.1109/MMM.2013.2240851
- ISSN
- 1527-3342
- Article Type
- Article
- Citation
- IEEE MICROWAVE MAGAZINE, vol. 14, no. 3, page. 68 - 81, 2013-05
- Files in This Item:
- There are no files associated with this item.
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