Flexible Organic Light-Emitting Diodes Using a Metal Peel-Off Method
SCIE
SCOPUS
- Title
- Flexible Organic Light-Emitting Diodes Using a Metal Peel-Off Method
- Authors
- Kim, SY; Kim, K; Hong, K; Lee, JL
- Date Issued
- 2008-11
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGI
- Abstract
- Organic light-emitting diodes were fabricated on a glass-MgO(x)-Ag layered substrate and separated between Ag and MgO(x) interface, showing the bending properties. Adhesive force decreased from 18 to 1.4 gf/cm after insertion of the MgO(x) layer between the Ag and glass. The Ag-O component in Ag 3d(5/2) spectra and O-Ag (ionic bond) component in O 1 s spectra increased as the MgO(x) layer was thickened. This supports that Ag oxidized to AgO(x) while the thickness of MgO(x) increased, resulting in a reduction of the adhesive forces of Ag layer. Therefore, it is concluded that a metal at the interface with a metal oxide is easily oxidized, reducing the adhesive forces and enabling the peel-off process.
- Keywords
- Adhesive force; flexible devices; organic light-emitting diodes (OLEDs); peel-off; work of adhesion; SURFACE; ADHESION; OLEDS
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/27889
- DOI
- 10.1109/LPT.2008.2004693
- ISSN
- 1041-1135
- Article Type
- Article
- Citation
- IEEE PHOTONICS TECHNOLOGY LETTERS, vol. 20, no. 21-24, page. 1836 - 1838, 2008-11
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