Micro heat flux sensor using copper electroplating in SU-8 microstructures
SCIE
SCOPUS
- Title
- Micro heat flux sensor using copper electroplating in SU-8 microstructures
- Authors
- Oh, SH; Lee, KC; Chun, J; Kim, M; Lee, SS
- Date Issued
- 2001-05
- Publisher
- IOP PUBLISHING LTD
- Abstract
- A micro heat flux sensor which can measure the thermal energy transfer per unit area has been designed, fabricated, and calibrated in a convective environment. The sensor which is based on a circular foil gage is composed of thermal paths and a thermopile. The thermal path is made in a LIGA-like process of SU-8 high aspect ratio microstructures and electroplated copper layers. The thermopile, a series of thermocouples, is used to amplify the output signal as a thermometer. When the sensor is placed on a high-temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along its paths. Heat flux is obtained by calibrating this temperature difference in the thermopile of Ni-Cr or Al-Chromel pairs. The sensitivity of the heat flux sensor of Ni-Cr and Al-Chromel pairs is in the range of 0.1-2.0 and 0.4-2.0 muV mW(-1) cm(-2), respectively, in the heat flux range of 0-180 mW cm(-2).
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/27959
- DOI
- 10.1088/0960-1317/11/3/310
- ISSN
- 0960-1317
- Article Type
- Article
- Citation
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING, vol. 11, no. 3, page. 221 - 225, 2001-05
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.