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Cited 2 time in webofscience Cited 2 time in scopus
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Overcoming of nanoscale adhesion by electrostatic induction SCIE SCOPUS KCI

Title
Overcoming of nanoscale adhesion by electrostatic induction
Authors
Kim, DPark, HCLee, KHPark, KBChoi, KHwang, W
Date Issued
2009-05
Publisher
ELSEVIER SCIENCE BV
Abstract
Polymeric nanopillar array was replicated by dipping of anodic aluminum oxide template into amorphous fluoropolymer (Teflon (R): DuPont (TM)) solution. The prepared anodic aluminum oxide template has the self-ordered nanohole structures with the high-aspect-ratio (more than 100). To obtain Teflon nanopillar array, Teflon replication based on the dipping method was used, with a 6 wt% Teflon solution. During the replication, the adhesion problem by the van der Waals interaction at micro/nanoscale was overcome by electrostatic induction. (C) 2008 Elsevier B.V. All rights reserved.
Keywords
Nanopillar; Anodic aluminum oxide; Van der Waals interaction; Electrostatic induction; ANODIC ALUMINUM-OXIDE; NANOSTRUCTURED SURFACES; NANOPILLAR ARRAYS; STAMP DEFORMATION; FABRICATION; TEMPLATE; CARBON; REPLICATION; FILMS
URI
https://oasis.postech.ac.kr/handle/2014.oak/28401
DOI
10.1016/j.cap.2008.06.017
ISSN
1567-1739
Article Type
Article
Citation
CURRENT APPLIED PHYSICS, vol. 9, no. 3, page. 703 - 706, 2009-05
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박현철PARK, HYUN CHUL
엔지니어링 대학원
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