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Comparison of La-based high-k dielectrics: HfLaSiON and HfLaON SCIE SCOPUS

Title
Comparison of La-based high-k dielectrics: HfLaSiON and HfLaON
Authors
Choi, WHHan, ISKwon, HMGoo, TGNa, MKYoo, OSLee, GWKang, CYChoi, RSong, SCLee, BHJammy, RJeong, YHLee, HD
Date Issued
2009-03
Publisher
ELSEVIER SCIENCE BV
Abstract
For the first time, we present a comparative study on HfLaSiON and HfLaON gate dielectric with an equivalent oxide thickness (EOT) of 0.8 nm (T-mv = 1.2 nm). A detailed DC analysis of I-on or I-off shows HfLaON performs somewhat better than HfLaSiON. However, positive bias temperature instability (PBTI) lifetime of HfLaSiON is higher than HfLaON by about 2 orders of magnitude. On the other hand, hot carrier stress lifetime for HfLaSiON was similar to that of HfLaON. From the activation energy and U-trap, we found that the cause of different threshold voltage (V-T) shifts under PBT stress and detrapping was originated from stable electron traps induced by different charge trapping rates. (C) 2008 Elsevier B.V. All rights reserved.
Keywords
High-k; HfLaON; HfLaSiON; Device performance; PBTI; Hot carrier; Reliability
URI
https://oasis.postech.ac.kr/handle/2014.oak/28756
DOI
10.1016/j.mee.2008.04.008
ISSN
0167-9317
Article Type
Article
Citation
MICROELECTRONIC ENGINEERING, vol. 86, no. 3, page. 268 - 271, 2009-03
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정윤하JEONG, YOON HA
Dept of Electrical Enginrg
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