A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Abstract

A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P ++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.