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Cited 4 time in scopus

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DC Field	Value	Language
dc.contributor.author	Lim, G	-
dc.contributor.author	Back, S	-
dc.contributor.author	Esashi, M.	-
dc.date.accessioned	2017-07-19T08:22:17Z	-
dc.date.available	2017-07-19T08:22:17Z	-
dc.date.created	2010-12-01	-
dc.date.issued	1998-09	-
dc.identifier.issn	1341-8939	-
dc.identifier.uri	https://oasis.postech.ac.kr/handle/2014.oak/34361	-
dc.description.abstract	A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P ++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.	-
dc.language	English	-
dc.publisher	WILEY	-
dc.relation.isPartOf	The Transactions of The Institute of Electrical Engineers of Japan	-
dc.title	A new bulk-micromachining using deep RIE and wet etching for an accelerometer	-
dc.type	Article	-
dc.identifier.doi	10.1541/ieejsmas.118.420	-
dc.type.rims	ART	-
dc.identifier.bibliographicCitation	The Transactions of The Institute of Electrical Engineers of Japan, v.118, no.9, pp.420 - 424	-
dc.citation.endPage	424	-
dc.citation.number	9	-
dc.citation.startPage	420	-
dc.citation.title	The Transactions of The Institute of Electrical Engineers of Japan	-
dc.citation.volume	118	-
dc.contributor.affiliatedAuthor	Lim, G	-
dc.identifier.scopusid	2-s2.0-85010120482	-
dc.description.journalClass	1	-
dc.description.journalClass	1	-
dc.description.journalRegisteredClass	scopus	-

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