DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jin, S | - |
dc.contributor.author | Park, B | - |
dc.contributor.author | Moon, K | - |
dc.contributor.author | Kim, J | - |
dc.contributor.author | Kwon, M | - |
dc.contributor.author | Kim, D | - |
dc.contributor.author | Kim, B | - |
dc.date.accessioned | 2017-07-19T12:15:04Z | - |
dc.date.available | 2017-07-19T12:15:04Z | - |
dc.date.created | 2016-01-15 | - |
dc.date.issued | 2015-08 | - |
dc.identifier.issn | 1531-1309 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/35514 | - |
dc.description.abstract | This letter presents a highly efficient CMOS power amplifier (PA) with adaptive envelope-tracking (ET) techniques. The linearity and efficiency of the PA are improved by ET-based techniques at the gate of the common-gate (CG), the gate of the common-source (CS), and the drain of the CG. The proposed CMOS ET PA is fabricated using a 0.18 mu m CMOS technology with a printed circuit board (PCB) transformer which has a lower insertion loss than CMOS one. Without any help of additional resources, the CMOS PA delivers an average output power of 27.5 dBm with a power-added efficiency (PAE) of 42.5%, an error vector magnitude (EVM) of 2.5%, and an ACLR(E-UTRA) of -36.5 dBc at 1.85 GHz for a long term evolution (LTE) signal with a bandwidth of 10 MHz and 7.5 dB peak-to-average power ratio (PAPR). | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.relation.isPartOf | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | - |
dc.title | A Highly Efficient CMOS Envelope Tracking Power Amplifier Using All Bias Node Controls | - |
dc.type | Article | - |
dc.identifier.doi | 10.1109/LMWC.2015.2440652 | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.25, no.8, pp.517 - 519 | - |
dc.identifier.wosid | 000359242900009 | - |
dc.date.tcdate | 2019-03-01 | - |
dc.citation.endPage | 519 | - |
dc.citation.number | 8 | - |
dc.citation.startPage | 517 | - |
dc.citation.title | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | - |
dc.citation.volume | 25 | - |
dc.contributor.affiliatedAuthor | Kim, B | - |
dc.identifier.scopusid | 2-s2.0-85027938817 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 10 | - |
dc.description.scptc | 6 | * |
dc.date.scptcdate | 2017-08-235 | * |
dc.description.isOpenAccess | N | - |
dc.type.docType | Article | - |
dc.subject.keywordAuthor | Adaptive bias | - |
dc.subject.keywordAuthor | CMOS | - |
dc.subject.keywordAuthor | differential | - |
dc.subject.keywordAuthor | envelope-tracking (ET) | - |
dc.subject.keywordAuthor | linearization | - |
dc.subject.keywordAuthor | LTE | - |
dc.subject.keywordAuthor | power amplifier (PA) | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
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