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Fabrication of high-aspect-ratio micro piezoelectric array by powder injection molding SCIE SCOPUS

Title
Fabrication of high-aspect-ratio micro piezoelectric array by powder injection molding
Authors
Han, JSGal, CWKim, JHPark, SJ
Date Issued
2016-06
Publisher
Elsevier
Abstract
A powder injection molding process to fabricate a high-aspect-ratio piezoelectric microarray was developed. The reverse shaped sacrificial mold insert was developed by X-ray micromachining, and then insert-type injection molding was conducted to fabricate the piezoelectric microarray structure. For the micro-powder injection molding, rheological properties of the powder binder mixture were evaluated and analyzed. The measured flow behavior exponent was 0.44 and the flow activation energy was 83 kJ/mol(-1). Based on the analyzed rheological property, injection molding conditions were optimized. The rheological property and the injection molding conditions were crucial to ensure complete filling. Using the optimized conditions, two high-aspect-ratio piezoelectric microarrays were fabricated: (i) 20-mu m patterns with 1:5 aspect ratio and (ii) 40-mu m patterns with 1:10 aspect ratio. (C) 2016 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
URI
https://oasis.postech.ac.kr/handle/2014.oak/36441
DOI
10.1016/J.CERAMINT.2016.03.011
ISSN
0272-8842
Article Type
Article
Citation
Ceramics International, vol. 42, no. 8, page. 9475 - 9481, 2016-06
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박성진PARK, SEONG JIN
Dept of Mechanical Enginrg
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